The U.S. Department of Commerce invests $874 million in seven semiconductor companies, betting on seven underlying technologies for the post-GPU era

On July 29, the U.S. Department of Commerce signed letters of intent with seven companies, totaling up to $874 million, to support seven "post-GPU era" underlying technology routes such as CPO, ferroelectric memory, and 3D packaging in the form of equity investments. This marks a shift in the U.S. chip strategy from "capacity reshoring" to "technology route selection."

The seven companies and their technology directions include: GlobalFoundries (CPO silicon photonic integration, $300 million), Kepler Computing (ferroelectric 3D memory, $245 million), Multibeam (multi-electron beam direct-write lithography and advanced packaging, $140 million), Extropic (thermodynamic sampling unit TSU, $75 million), Thintronics (ultra-low loss dielectric materials, $50 million), Aeluma (large-size phosphorus-free optoelectronic device substrates, $30 million), and OBSIDIA (hardware zero-trust chip anti-counterfeiting, $34 million). All companies are required to provide non-controlling minority equity to the U.S. government.

This move shows that the funding usage of the CHIPS Act is shifting from subsidizing wafer fabs to directly holding equity in cutting-edge technology companies with national capital, in order to secure rule-making authority in the post-Moore era.