Samsung Galaxy Z Fold8 DDI supply is tight, planning to use next year's development quantity

Samsung Electronics has launched the passport-type foldable smartphone Galaxy Z Fold8 this year, and the supply of display driver chips (DDI) is tight. The demand for Z Fold8 has exceeded expectations, and Samsung is increasing component orders. However, this DDI is designed by Samsung's System LSI Division and produced by Taiwan's foundry UMC using a 22-nanometer process, which has reached its production capacity limit, making it difficult to advance the production schedule.

Industry insiders say that UMC's 22-nanometer production line is also manufacturing other chips, and Samsung's request for super urgent service was rejected. Samsung plans to prioritize the DDI quantity originally reserved for development next year for mass production this year. The typical time from wafer to finished product takes about 4 months, and the finished product is then assembled after being bonded with Samsung's OLED. Samsung is also increasing orders for hinges and ultra-thin glass (UTG). The demand for Z Flip8 is in line with lower expectations, and Apple also plans to launch a passport-type foldable product in the second half of this year.