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first_img Samsung Electronics adjusts the next-generation DRAM roadmap, naming B1b as D0a

According to a report by ZDNet Korea, Samsung Electronics is adjusting its next-generation DRAM strategy by incorporating the previously project-based B1b into its official roadmap, naming it the first DRAM D0a below 10 nanometers. Previously, D0a referred to vertical transistor DRAM, and this product is now classified separately as D0a-V. This renaming aims to accelerate the introduction of advanced packaging in general DRAM.B1b will manufacture storage cells and peripheral driver circuits on different wafers before bonding them together, using wafer-to-wafer hybrid bonding and directly connecting through copper interconnects. The currently commercialized DRAM is 1c, which is the 6th generation 10 nanometer level, with a line width of about 11 to 12 nanometers; the next generation 1d is the 7th generation 10 nanometer level, with a line width of about 10 to 11 nanometers, considered effectively the last 10 nanometer level product, with the related line width being a marketing term rather than an actual physical size. Vertical transistors can arrange transistors within the cell vertically, reducing the cell area from 6F² to 4F², but they need to address high aspect ratio etching and leakage current, making development more challenging. Wafer-to-wafer hybrid bonding has already been mass-produced in CMOS image sensors and high-stacking NAND.Samsung Electronics is evaluating the use of B1b for the 8th generation high bandwidth memory HBM5. HBM5 is expected to be mass-produced around 2029, aiming to increase operating speed by more than 50% compared to HBM4E. Industry estimates suggest that D0a DRAM based on B1b will be commercially available in about two years, with specific mass production investment schedules likely to be determined by mid-next year.

first_img Research institution Sage Road Research stated that the stock price of the AI company has dropped 20% from its peak in June

The research institution Sage Road Research released an executive summary of "The AI Trade," stating that since the beginning of this year, the Magnificent Seven has underperformed the Russell 3000 index by about 8 percentage points and the MSCI ACWI by nearly 9 percentage points. In July, the CBOE NDX volatility index relative to the VIX reached its highest point since the internet bubble, and after entering a correction, the Nasdaq index saw a 5% rebound over four days. As of the writing of the report, AI company stock prices have dropped 20% from their 52-week highs in June.Companies are struggling to achieve returns on investment amid soaring AI costs, with Uber, Amazon, Meta, and Walmart implementing restrictions on employee AI usage. Model homogenization limits pricing power, and Chinese open-source models have become a cheap alternative to OpenAI and Anthropic. AI capital expenditures have exceeded expectations, with the consensus for 2026 rising from $527 billion at the end of 2025 to about $800 billion by mid-year. Capital expenditures for hyperscale cloud providers in 2027 are expected to account for 3% of U.S. GDP, more than double the peak of 1.2% during the late 1990s telecom fiber construction. Allianz Research calculates that there is nearly a 46% growth gap between AI investment and sales, worse than the 32% during the 2001 telecom bubble.As of June, hyperscale cloud providers and related entities like Nvidia issued $225 billion in bonds, a year-on-year increase of 973.7%. The off-balance-sheet liabilities of tech giants have increased eightfold over four years to $1.65 trillion.
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