BTC $62,899.78 +0.29%
ETH $1,876.81 +0.18%
BNB $610.69 +0.99%
XRP $1.00 +0.11%
SOL $75.20 -0.20%
TRX $0.3308 -0.66%
DOGE $0.0699 +0.89%
ADA $0.1782 -0.58%
BCH $204.25 +0.28%
LINK $9.43 +6.51%
HYPE $56.03 -0.05%
AAVE $86.34 +1.02%
SUI $0.6818 +0.92%
XLM $0.1578 -0.86%
ZEC $489.77 +1.29%
BTC $62,899.78 +0.29%
ETH $1,876.81 +0.18%
BNB $610.69 +0.99%
XRP $1.00 +0.11%
SOL $75.20 -0.20%
TRX $0.3308 -0.66%
DOGE $0.0699 +0.89%
ADA $0.1782 -0.58%
BCH $204.25 +0.28%
LINK $9.43 +6.51%
HYPE $56.03 -0.05%
AAVE $86.34 +1.02%
SUI $0.6818 +0.92%
XLM $0.1578 -0.86%
ZEC $489.77 +1.29%

vance

All
Article
Flash

hot_img Intel's EMIB-T advanced packaging faces yield challenges, with the first mass production target in 2027 only at 50%

According to Taiwanese media reports, Intel's next-generation advanced packaging technology EMIB-T is facing severe yield challenges. ABF substrate supplier Unimicron stated during its earnings call on July 29 that the technology is "not yet mature," and the yield target for three EMIB-T substrate suppliers (Unimicron, Ibiden, and Shinkawa) during the initial mass production phase at the end of 2027 is only 50%.EMIB-T is Intel's advanced packaging solution that competes with TSMC's CoWoS-L, differing in that it embeds the silicon bridge directly into the substrate rather than using a silicon interposer, making substrate suppliers a key factor in determining success or failure. Google's ninth-generation TPU has confirmed that it will adopt EMIB-T packaging when it goes into mass production in 2028, with MediaTek responsible for chip co-design. If the chip successfully goes into mass production, its shipment volume is expected to challenge NVIDIA. Unimicron stated that the customer (Intel) has provided a profit guarantee mechanism, ensuring that suppliers can remain profitable even if yields are poor, and that profit margins will exceed the company's average level after achieving the 50% yield target. Currently, there is still considerable uncertainty about whether EMIB-T can achieve its mass production target by the end of 2027.

Solana plans to advance a supply tightening scheme, with the daily SOL burn amount possibly increasing from $47,000 to $650,000

The Solana community is advancing two governance proposals aimed at reducing the new issuance of SOL and increasing the scale of network fee burns, thereby tightening the token supply. Among them, governance proposal SIMD-0553 suggests introducing a resource consumption-based transaction fee mechanism, charging fees based on the network resources consumed by transactions. It is expected to increase the daily burn of SOL from the current approximately 650 coins (about $47,000) to between 7,500 and 9,000 coins (about $650,000).Another proposal, SIMD-0550, plans to double the rate of decline in SOL's annual inflation, bringing the minimum inflation target of 1.5% forward to 2029 instead of the originally planned 2032. This plan is expected to reduce the issuance of approximately 18.9 million SOL over the next six years, valued at about $1.36 billion at current prices. Currently, both proposals have received support from some validator nodes. As of the latest data, approximately 24.94 million SOL have participated in signaling votes, accounting for 5.8% of the 4.3265 million staked SOL, still about 39.95 million SOL short of the 15% threshold required to enter the formal voting phase. The deadline for supporting signals is August 18.A total of 16 validator nodes have expressed support, with the infrastructure company Helius contributing approximately 16.03 million SOL, accounting for nearly two-thirds of the current support. However, even if SIMD-0553 is successfully implemented, SOL will not immediately enter a deflationary state. Based on a maximum daily burn of 9,000 coins, it is still lower than the current daily new issuance of about 60,000 coins. Therefore, the community is advancing the burn mechanism and the reduction of issuance as linked reforms. If the proposal receives sufficient support from validator nodes, the Solana network will improve its long-term token economic model through a dual mechanism of "reducing new supply + increasing burns."

hot_img The industry claims that the DRAM capacity for 2027 has been sold out in advance, with HBM accounting for nearly 70% of DRAM capacity

According to DIGITIMES, industry insiders revealed that the three major memory manufacturers have completed the capacity allocation negotiations for the entire year of 2027 in advance, with both DRAM and HBM capacities sold out. In terms of NAND Flash, although it is not as tight as DRAM, it is expected that the capacity will also be fully booked by the end of August 2026. ADATA Chairman Chen Libai confirmed that applications related to HBM and AI servers will account for nearly 70% of DRAM capacity, while the supply of DRAM for PCs and mobile phones will be relatively limited.Industry assessments indicate that Samsung, Micron, and SanDisk's NAND capacity for the entire year of 2027 has also been pre-sold, with Kioxia and SK Hynix expected to confirm by the end of August. SK Group Chairman Chey Tae-won previously stated that the demand for AI semiconductors in 2027 is expected to increase by 60-100% compared to 2026, with storage demand expected to grow by 50-60%, leading to a potential widening of the supply-demand gap and possibly facing "the most severe shortage in history." Industry insiders pointed out that the capacity allocation model is more orderly compared to 2026, but the amount that manufacturers can provide is usually only 60-70% of customer demand, leaving some small and medium buyers still facing the dilemma of having no products to purchase. The price increase of memory may slow down in 2027, but remaining high could become the norm.
app_icon
ChainCatcher Building the Web3 world with innovations.