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nand

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Flash

hot_img SK Hynix will expand its NAND production capacity in Dalian by about 50%, with the second factory in Dalian expected to start production in the first half of next year

SK Hynix has restarted the construction of its second NAND flash memory factory in Dalian, expecting to increase the monthly production capacity in the region by about 50%. The new production line is designed for a monthly capacity of approximately 50,000 wafers, combined with the existing Dalian Plant 1's monthly capacity of 100,000 wafers, bringing SK Hynix's total NAND production capacity in China to about 150,000 wafers per month. The factory began construction four years ago but was paused due to the downturn in the memory chip market and U.S. export restrictions on equipment to China, having only completed the structural framework.The investment in Dalian Plant 2 is driven by SK Hynix's NAND subsidiary Solidigm, with equipment installation expected to start as early as November this year, and plans to establish a mass production system in the first half of next year. Driven by the expansion of AI data centers, demand for enterprise-level SSDs has surged, with NAND prices rising nearly tenfold compared to a year ago, prompting the restart of investments. SK Hynix will adopt a dual-track strategy: the Dalian factory will use Intel's mature floating gate architecture to produce NAND at the hundred-layer level, while domestic factories like Cheongju M17 will focus on advanced NAND production of over 300 layers, the latter having announced an investment of 19.1 trillion won. Industry insiders expect that the equipment configuration of Dalian Plant 2 will be similar to that of Plant 1, maintaining a monthly production capacity in the range of 40,000 to 60,000 wafers.

hot_img Kioxia accelerates AI with NAND layout, mass-producing PCIe 6.0 and UFS 5.0 products to catch up with Korean manufacturers

Japanese NAND manufacturer Kioxia is accelerating its layout in the AI NAND market. This year, it has launched mass production of the 10th generation (BiCS 10) 332-layer 3D NAND and based on this, introduced the PCIe 6.0 supported data center eSSD "CM10," which has improved sequential read performance by up to 92% compared to the previous generation. In addition, Kioxia plans to start mass production of UFS 5.0 embedded storage by the end of this year, with data transfer speeds approximately doubling compared to UFS 4.1, primarily targeting the AI mobile device market. According to TrendForce data, Kioxia's global NAND market share in the first quarter of this year was 13.9%, ranking third, following Samsung Electronics (31.6%) and SK Hynix (17.6%).Korean manufacturers are also quickening their pace. Samsung has begun mass production of the PCIe 6.0 eSSD "PM1763" last month, equipped with the 9th generation V-NAND and a 4nm controller, with plans to mass produce UFS 5.0 in the fourth quarter. Samsung also announced that it will start mass production of the 10th generation V-NAND (approximately 430 layers) this month, applying hybrid bonding and triple stacking technology for the first time. Industry analysts believe that Kioxia is quite competitive in terms of the speed of technological iteration, but its production capacity still lags behind Korean manufacturers, and competition in the AI storage market will become even more intense in the future.

Analyst: Recent negative rumors about NAND have been exaggerated; SanDisk's low-priced LTA is a strategic choice rather than weak demand

Citrini analyst Jukan published a response to the recent market rumors regarding bearish notes on NAND and negative news about QLC price negotiations. It is not surprising that SanDisk accepted a price lower than the initial offer when signing a long-term agreement with Meta, as SanDisk is one of the most proactive NAND manufacturers in pursuing LTAs, planning to allocate over 50% of its total shipments to such agreements. Based on this strategy, it is naturally willing to accept LTA prices lower than the current quarterly contract price, and it cannot be inferred that "SanDisk cannot seamlessly resell all orders to higher-bidding North American customers."In response to rumors that Chinese module manufacturers were rejected by domestic CSPs when promoting eSSD, Jukan explained that Chinese CSPs have direct procurement channels with Yangtze Memory Technologies and that the issue is not a lack of demand. Regarding the claim that large-scale cloud providers are driving down prices for QLC eSSD, leading to some volumes not being sold, he believes that new cloud providers have sufficient demand to absorb these volumes.Jukan concluded by stating that negative headlines are more easily amplified when storage stocks perform poorly, but the fundamentals have not shown substantial deterioration. He reiterated that he remains bullish on storage. Previously, Jukan had stated that DRAM contract prices still have about a 40% upside potential until the end of 2027, and HBM supply continues to be tight. This clarification on the NAND side further solidifies his bullish stance on the entire storage sector.
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