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The ULTRA Web3 Festival in Kuala Lumpur has successfully concluded and will join hands with Web3Labs to showcase at the GWDC 2026 conference in South Korea

The ULTRA Web3 Festival successfully concluded on July 30-31 at The Arch Galeries in Kuala Lumpur. As the core site of the "Global Series Conference Integrating Web3, Traditional Finance, and Artificial Intelligence," this two-day summit brought together international builders, business leaders, and institutional investors to build a bridge between decentralized technology and traditional markets.The success of the Kuala Lumpur event was attributed to the support of a wide range of visionary alliances and industry-leading sponsors, including Pudgy Penguins, Orca, DDNEXUS, Alpha Insight, AI Nova, Decentralized Intelligence, SuperFlow, CloudBank, Morpheus, Razer, ChainUp, DYLI, Saat Dimensi, Oper8 Capital, Lavo Protocol, WageFlow, Echobit Exchange, LifyX Exchange, X18, and Starshine. Additionally, the event further expanded its influence through strategic collaboration with key ecosystem partners such as Access Blockchain Association, CCACC, Emerge Group, Global Impact Fintech, Web3Labs, and ADI Foundation.It is reported that the ULTRA Web3 Festival is set to enter the South Korean market, partnering with Web3Labs as the official global business partner to appear at the second Global Web3 Developers Conference (GWDC 2026 Korea). The conference is scheduled to take place on September 29-30 at the aT Center in Seoul, where both parties will promote cross-border collaboration, technology exchange, and drive international business growth in the Asia-Pacific region.

hot_img TrendForce: DRAM supply tightness will continue until 2027, Nvidia assesses and lowers Rubin Ultra HBM configuration

According to the latest research by TrendForce, the tight supply of DRAM is expected to continue until 2027, and the uncertainty of the HBM4e verification schedule is prompting AI chip manufacturers to consider reducing the HBM configuration of their next-generation products. Starting from Q3 2026, NVIDIA has begun evaluating the HBM solution for Rubin Ultra, expanding from the original 12-Hi HBM4e to alternative options such as 8-Hi HBM4e, 12-Hi HBM4, and 8-Hi HBM4, with the final specifications yet to be determined. Previously, due to the expected supply bottleneck of LPDDR5X lasting until 2027, NVIDIA decided to halve the SOCAMM capacity of the next-generation Vera Rubin Superchip module.TrendForce pointed out that the main reasons for the downgrade of Rubin Ultra from 12-Hi HBM4e include: the overall DRAM shortage in 2027 will limit the allocation of wafer capacity to HBM, and there is still uncertainty regarding the mass production schedule and yield ramp-up of 12-Hi HBM4e. It is expected that the HBM bit shipment volume in 2027 will increase by approximately 50-60% year-on-year, which will still be insufficient to meet the growth in demand. HBM suppliers will maintain pricing power throughout 2027, and HBM prices are expected to rise significantly. The final configuration will depend on the wafer allocation decisions of memory suppliers.
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